3U Radcube Structure

C3S has developed a 3U CubeSat structure that uses backplane PCB for bus communication, which is intended to provide independent assembly order, simplifies the stack-up tolerances and uses space graded interface connectors. Its benefits include:

  • High reliability electronic, structural and thermal connections
  • Access to individual cards and units during integration and testing
  • Simplified stack-up tolerances
  • Dedicated and independent thermal interfaces for all cards
Specifications
Mass:
752 g
Dimensions:
340.5 x 100 x 100 mm
Form Factor:
3U
Documents