3U RadCube Structure - C3S - SmallSat Catalog - Orbital Transports
Additional Information
Mass:
752 g
Dimensions:
340.5 x 100 x 100 mm
Form Factor:
3U
Documentation

C3S has developed a 3U CubeSat structure that uses backplane PCB for bus communication, which is intended to provide independent assembly order, simplifies the stack-up tolerances and uses space graded interface connectors. Its benefits include:

  • High reliability electronic, structural and thermal connections
  • Access to individual cards and units during integration and testing
  • Simplified stack-up tolerances
  • Dedicated and independent thermal interfaces for all cards

3U Radcube Structure

C3S Electronics Development
Description

C3S has developed a 3U CubeSat structure that uses backplane PCB for bus communication, which is intended to provide independent assembly order, simplifies the stack-up tolerances and uses space graded interface connectors. Its benefits include:

  • High reliability electronic, structural and thermal connections
  • Access to individual cards and units during integration and testing
  • Simplified stack-up tolerances
  • Dedicated and independent thermal interfaces for all cards
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Additional Information
Mass:
752 g
Dimensions:
340.5 x 100 x 100 mm
Form Factor:
3U
Documentation

C3S has developed a 3U CubeSat structure that uses backplane PCB for bus communication, which is intended to provide independent assembly order, simplifies the stack-up tolerances and uses space graded interface connectors. Its benefits include:

  • High reliability electronic, structural and thermal connections
  • Access to individual cards and units during integration and testing
  • Simplified stack-up tolerances
  • Dedicated and independent thermal interfaces for all cards