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C3S has developed a 3U CubeSat structure that uses backplane PCB for bus communication, which is intended to provide independent assembly order, simplifies the stack-up tolerances and uses space graded interface connectors. Its benefits include:
- High reliability electronic, structural and thermal connections
- Access to individual cards and units during integration and testing
- Simplified stack-up tolerances
- Dedicated and independent thermal interfaces for all cards
| Parameter | Value |
|---|---|
| Mass | 752 g |
| Dimensions | 340.5 x 100 x 100 mm |
| Form Factor | 3U |
| Type | Document Name | Action & Size |
|---|---|---|
| No public documentation available. Please inquire for details. | ||
